Assembly Process Engineering Manager – Semiconductor Packaging

Assembly Process Engineering Manager- Semiconductor Packaging Location: Ahmedabad, Gujarat, India Work Mode: Onsite Employment Type: Full-Time Experience: 12 -18 Years Industry: Semiconductor / ATMP / OSAT / IC Packaging Role Overview We are looking for an Assembly Process Engineering Manager to lead semiconductor packaging-process engineering in a high-volume ATMP/OSAT manufacturing environment. The role will own process development, qualification, production ramp-up, process stability, yield improvement and engineering-team performance. The position requires hands-on expertise in die preparation, die attach, wire bonding, molding, marking and package singulation, along with proven experience leading cross-functional engineering programs. Key Responsibilities Lead the assembly process-engineering team supporting high-volume semiconductor packaging operations. Own process performance across wafer preparation, die attach, wire bonding, molding, marking and singulation. Develop and optimize process recipes, process windows, control plans and operating procedures. Lead process characterization, equipment qualification and production release activities. Drive new-product introduction, package qualification and transfer into volume manufacturing. Execute DOE, SPC and process-capability studies to improve yield and process stability. Monitor defect trends, scrap, rework, process excursions and critical manufacturing parameters. Lead root-cause analysis and corrective actions for process, material, equipment and package-quality issues. Collaborate with equipment engineering to improve equipment capability, uptime and repeatability. Work with product engineering, quality, reliability and manufacturing teams to meet production targets. Qualify new assembly materials, consumables, suppliers and process changes. Develop PFMEA, control plans, OCAPs, 8D reports and CAPA actions. Reduce process variation, manufacturing cycle time, scrap and cost of poor quality. Establish Best Known Methods and ensure consistent implementation across production lines. Build technical capability through recruitment, training, mentoring and succession planning. Support internal, customer and quality-system audits related to assembly processes. Required Qualifications Bachelor s or Master s degree in Electronics, Electrical, Mechanical, Materials, Chemical, Manufacturing Engineering or a related discipline. 12 -18 years of experience in semiconductor assembly, IC packaging, ATMP, OSAT or IDM backend manufacturing. At least 4- 6 years of experience managing process engineers or leading major assembly-engineering programs. Strong hands-on experience in multiple semiconductor packaging processes. Experience transferring new products and processes into high-volume manufacturing. Proven success in yield improvement, defect reduction and process-capability enhancement. Experience working with manufacturing, equipment, product, quality, reliability and supplier teams. Ability to support production escalations in a 24 x7 manufacturing environment. Technical Skills Assembly and Packaging Processes Wafer mounting, backgrinding and dicing Die preparation and die sorting Die attach and die bonding Wire bonding Flip-chip assembly Underfill and encapsulation Transfer or compression molding Trim and form Laser marking Package singulation Package inspection and handling Process Engineering Process development and characterization Process-window optimization Equipment and process qualification Design of Experiments Statistical Process Control Process Capability Analysis Measurement System Analysis Defect and variation reduction Recipe and parameter management Best Known Method development Quality and Problem-Solving PFMEA Control plans OCAP 8D problem-solving Root-cause analysis CAPA Fault Tree Analysis Process excursion management Change-point control Continuous improvement Packaging Materials Die-attach adhesives and films Bond wires and bonding materials Mold compounds Substrates and leadframes Underfill materials Solder and interconnect materials Material qualification Supplier process qualification #LI-SD1 Show more