We are looking for a Package Equipment Engineering Manager/Lead to manage equipment engineering for high-volume semiconductor assembly and packaging operations. The role will own equipment installation, qualification, performance, availability, maintenance strategy and continuous improvement across assigned packaging process areas. The position requires hands-on experience with semiconductor assembly equipment, strong equipment troubleshooting capability and demonstrated leadership of engineers, technicians and equipment-improvement programs.
Responsibilities
- Lead the package equipment-engineering team supporting 24/7 semiconductor manufacturing operations.
- Own equipment performance across die preparation, die attach, wire bonding, molding, marking and package singulation.
- Manage equipment installation, setup, acceptance testing, qualification and production release.
- Develop equipment specifications, user requirements and technical acceptance criteria.
- Coordinate equipment hook-up, safety checks, calibration and process qualification activities.
- Establish preventive, predictive and condition-based maintenance strategies.
- Improve equipment availability, utilization, OEE, mean time between failures and mean time to repair.
- Lead technical troubleshooting for chronic equipment failures, process excursions and production interruptions.
- Use equipment data, alarms, logs and failure history to identify performance-improvement opportunities.
- Develop maintenance procedures, spare-parts strategies, equipment checklists and escalation mechanisms.
- Manage equipment vendors during installation, warranty support, upgrades and corrective actions.
- Partner with process engineering to improve equipment capability, repeatability and process control.
- Support new-product introduction, capacity expansion and production ramp-up requirements.
- Drive equipment automation, sensor integration, data collection and predictive-maintenance initiatives.
- Lead equipment modifications, retrofits, cost reduction and productivity-improvement projects.
- Ensure compliance with EHS, equipment-safety, cleanroom and quality requirements.
- Build technical capability through recruitment, training, mentoring and competency development.
- Prepare performance dashboards and communicate equipment risks, recovery plans and capital requirements.
- Build and lead a capable package equipment-engineering organization.
- Establish equipment ownership across process modules and production lines.
- Define escalation procedures and technical response requirements.
- Develop engineers and technicians through structured training and mentoring.
- Manage staffing, shift coverage and on-call support for continuous operations.
- Coordinate equipment resources during installation, capacity ramp and critical failures.
- Establish vendor-performance and equipment-maintenance review mechanisms.
Requirements
- Bachelor’s or Master’s degree in Mechanical, Electrical, Electronics, Mechatronics, Instrumentation, Automation Engineering or a related discipline.
- 12–18 years of equipment-engineering experience in semiconductor assembly, packaging, ATMP, OSAT or IDM backend manufacturing.
- At least 4–6 years of experience leading equipment engineers, technicians or major equipment programs.
- Strong hands-on experience with multiple semiconductor packaging equipment platforms.
- Demonstrated experience in equipment installation, qualification and high-volume manufacturing support.
- Proven record of improving OEE, equipment availability, MTBF, MTTR and manufacturing capacity.
- Experience managing equipment vendors, service contracts, spare parts and technical escalations.
- Ability to support production and equipment escalations in a 24/7 manufacturing environment.
Additional details
- Location: Ahmedabad, Gujarat, India
- Work Mode: Onsite
- Employment Type: Full-Time
- Industry: Semiconductor / ATMP / OSAT / IC Packaging
- Technical Skills: Semiconductor Packaging Equipment (Wafer mounters and backgrinders, Wafer saw and dicing systems, Die sorters and pick-and-place systems, Die bonders and die-attach equipment, Wire bonders, Flip-chip bonders, Underfill and dispensing systems, Transfer or compression molding equipment, Trim-and-form systems, Laser marking equipment, Package saw and singulation systems, Inspection and material-handling equipment)
- Equipment Engineering: Equipment installation and commissioning, Site Acceptance Test and Factory Acceptance Test, Equipment qualification and production release, Equipment capability analysis, Preventive and predictive maintenance, Condition monitoring, Calibration and metrology, Equipment modification and retrofit, Troubleshooting and fault isolation, Spare-parts and lifecycle management
- Automation and Controls: PLC and industrial controls, Servo and motion-control systems, Sensors, pneumatics and robotics, Machine vision, Equipment software and alarm systems, SECS/GEM, Equipment data collection, Manufacturing Execution Systems integration, Automated material handling, Predictive-maintenance analytics
- Reliability and Improvement Tools: Overall Equipment Effectiveness, Mean Time Between Failures, Mean Time to Repair, Failure Mode and Effects Analysis, Root-cause analysis, 8D problem-solving, Fault Tree Analysis, Pareto analysis, Total Productive Maintenance, Statistical Process Control
- Key Performance Indicators: Equipment availability, Overall Equipment Effectiveness, Mean Time Between Failures, Mean Time to Repair, Equipment utilization, Unplanned downtime, Preventive-maintenance compliance, Equipment-related yield loss, Units per hour, Maintenance cost, Spare-parts availability, Capacity and production readiness
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