Assembly Process Engineering Manager – Semiconductor Packaging

Best NanoTech

Ahmedabad, Gujarat, IndiaonsitePosted 2 days ago

Skill Required

FulltimeEngineering Manager

Key highlights

Required experience: 12–18 years in semiconductor assembly/packaging.
Management experience: 4–6 years leading process engineers or major programs.
Work mode: Onsite at Ahmedabad, Gujarat, India.
Employment type: Full‑Time.
Industry focus: ATMP/OSAT high‑volume semiconductor packaging.
Key responsibility: Yield improvement and process stability.

Role overview

We are looking for an Assembly Process Engineering Manager to lead semiconductor packaging-process engineering in a high-volume ATMP/OSAT manufacturing environment. The role will own process development, qualification, production ramp-up, process stability, yield improvement and engineering-team performance. The position requires hands-on expertise in die preparation, die attach, wire bonding, molding, marking and package singulation, along with proven experience leading cross-functional engineering programs.

Responsibilities

Lead the assembly process-engineering team supporting high-volume semiconductor packaging operations.
Own process performance across wafer preparation, die attach, wire bonding, molding, marking and singulation.
Develop and optimize process recipes, process windows, control plans and operating procedures.
Lead process characterization, equipment qualification and production release activities.
Drive new-product introduction, package qualification and transfer into volume manufacturing.
Execute DOE, SPC and process-capability studies to improve yield and process stability.
Monitor defect trends, scrap, rework, process excursions and critical manufacturing parameters.
Lead root-cause analysis and corrective actions for process, material, equipment and package-quality issues.
Collaborate with equipment engineering to improve equipment capability, uptime and repeatability.
Work with product engineering, quality, reliability and manufacturing teams to meet production targets.
Qualify new assembly materials, consumables, suppliers and process changes.
Develop PFMEA, control plans, OCAPs, 8D reports and CAPA actions.
Reduce process variation, manufacturing cycle time, scrap and cost of poor quality.
Establish Best Known Methods and ensure consistent implementation across production lines.
Build technical capability through recruitment, training, mentoring and succession planning.
Support internal, customer and quality-system audits related to assembly processes.

Requirements

Bachelor’s or Master’s degree in Electronics, Electrical, Mechanical, Materials, Chemical, Manufacturing Engineering or a related discipline.
12 – 18 years of experience in semiconductor assembly, IC packaging, ATMP, OSAT or IDM backend manufacturing.
At least 4 – 6 years of experience managing process engineers or leading major assembly-engineering programs.
Strong hands‑on experience in multiple semiconductor packaging processes.
Experience transferring new products and processes into high‑volume manufacturing.
Proven success in yield improvement, defect reduction and process‑capability enhancement.
Experience working with manufacturing, equipment, product, quality, reliability and supplier teams.
Ability to support production escalations in a 24 × 7 manufacturing environment.
Technical Skills: Wafer mounting, backgrinding and dicing; Die preparation and die sorting; Die attach and die bonding; Wire bonding; Flip‑chip assembly; Underfill and encapsulation; Transfer or compression molding; Trim and form; Laser marking; Package singulation; Package inspection and handling.
Process Engineering skills: Process development and characterization; Process‑window optimization; Equipment and process qualification; Design of Experiments; Statistical Process Control; Process Capability Analysis; Measurement System Analysis; Defect and variation reduction; Recipe and parameter management; Best Known Method development.
Quality and Problem‑Solving skills: PFMEA; Control plans; OCAP; 8D problem‑solving; Root‑cause analysis; CAPA; Fault Tree Analysis; Process excursion management; Change‑point control; Continuous improvement.
Packaging Materials knowledge: Die‑attach adhesives and films; Bond wires and bonding materials; Mold compounds; Substrates and leadframes; Underfill materials; Solder and interconnect materials; Material qualification; Supplier process qualification.